Semiconductor devices and methods for manufacturing the same

ABSTRACT

A semiconductor device includes a substrate including first and second active patterns thereon, a first gate electrode intersecting the first and second active patterns, first and second source/drain regions on the first and second active patterns, respectively, at one side of the first gate electrode, and an active contact on the first source/drain region so as to be electrically connected to the first source/drain region. The active contact includes a first sub-contact and a second sub-contact. The second sub-contact includes a vertical extension vertically extending toward the substrate. A bottom surface of the vertical extension is lower than a bottom surface of the first sub-contact.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application is a continuation of U.S.patent application Ser. No. 15/086,660, filed Mar. 31, 2016, whichitself claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2015-0046293, filed on Apr. 1, 2015, in the KoreanIntellectual Property Office, the disclosures of both of which arehereby incorporated by reference in their entireties.

BACKGROUND

The inventive concepts relate to semiconductor devices and methods formanufacturing the same. More particularly, the inventive concepts relateto semiconductor devices including field effect transistors and methodsfor manufacturing the same.

Semiconductor devices may be attractive in the electronics industrybecause of their small sizes, multi-functional characteristics, and/orrelatively low manufacture costs. Semiconductor devices may becategorized as memory devices for storing logical data, logic devicesfor processing logical data, and hybrid semiconductor devices having thefunctionalities of both the memory devices and the logic devices.Semiconductor devices with excellent characteristics may be increasinglydemanded with the development of the electronics industry. For example,high-reliability, high-speed, and/or multi-functional semiconductordevices may be increasingly demanded. To satisfy these demands,structures in semiconductor devices may become more complex andsemiconductor devices may become more highly integrated.

SUMMARY

Embodiments of the inventive concepts may provide semiconductor devicesincluding an active contact, which is capable of improving reliability.

Embodiments of the inventive concepts may also provide methods formanufacturing semiconductor devices with improved reliability by a lesscomplex process.

According to some embodiments, a semiconductor device includes asubstrate including active patterns extending in parallel thereon; agate electrode extending across the active patterns; respectivesource/drain regions in the active patterns at opposite sides of thegate electrode; and respective active contacts on and electricallycontacting the respective source/drain regions. At least one of therespective active contacts includes a first sub-contact extending on acorresponding one of the respective source/drain regions opposite thesubstrate, and a second sub-contact extending toward the substratebeyond the first sub-contact and between adjacent ones of the activepatterns. The second sub-contact is separated from the adjacent ones ofthe active patterns by an insulating material.

In some embodiments, the semiconductor device may further includerespective conductive connection patterns between the respectivesource/drain regions and the respective active contacts thereon. Therespective conductive connection patterns and the respective activecontacts may include different materials. The second sub-contact of theat least one of the respective active contacts may extend towards thesubstrate between ones of the respective conductive connection patternson the adjacent ones of the active patterns and may be separated fromsidewalls of the ones of the respective conductive connection patternsby the insulating material.

In some embodiments, respective upper surfaces of the first and secondsub-contacts opposite the substrate may be coplanar, and the first andsecond sub-contacts of the at least one of the respective activecontacts may define a unitary member.

In some embodiments, the semiconductor device may further include deviceisolation layers on the substrate between the active patterns. Theinsulating material may be an interlayer insulating layer on the deviceisolation layers. The second sub-contact of the at least one of therespective active contacts may extend towards the substrate beyond asurface of the gate electrode and into the interlayer insulating layerbut may be confined above the device isolation layers, and the firstsub-contact of the at least one of the respective active contacts may beconfined above the surface of the gate electrode.

In some embodiments, the semiconductor device may further include aconductive via on the respective upper surfaces of the first and/orsecond sub-contacts of the at least one of the respective activecontacts. The via may be between ones of the active patterns in planview. A conductive line on the conductive via may be electricallyconnected to the at least one of the respective active contacts thereby.

In some embodiments, the respective active contacts may have coplanarsurfaces. Another of the respective active contacts may include thefirst sub-contact extending on a corresponding one of the respectivesource/drain regions opposite the substrate, but may be free of thesecond sub-contact extending toward the substrate beyond the firstsub-contact and between adjacent ones of the active patterns.

In some embodiments, the first sub-contact of the at least one of therespective active contacts may extend in a different direction than thesecond sub-contact thereof to increase a contact area thereof. Forexample, the first sub-contact of the at least one of the respectiveactive contacts may extend parallel to the gate electrode, and thesecond sub-contact of the at least one of the respective active contactsmay extend perpendicular to the gate electrode and parallel to theactive patterns.

In one aspect, a semiconductor device may include a substrate includingfirst and second active patterns formed thereon, the first and secondactive patterns extending in a first direction parallel to a top surfaceof the substrate, a first gate electrode intersecting the first andsecond active patterns and extending in a second direction intersectingthe first direction, first and second source/drain regions respectivelyprovided in upper portions of the first and second active patterns atone side of the first gate electrode, the first and second source/drainregions spaced apart from each other in the second direction, and anactive contact disposed on the first source/drain region so as to beelectrically connected to the first source/drain region. The activecontact may include a first sub-contact overlapping with the firstsource/drain region in plan view, and a second sub-contact providedbetween the first and second source/drain regions in plan view. Thesecond sub-contact may include a vertical extension vertically extendingtoward the substrate, and a bottom surface of the vertical extension maybe lower than a bottom surface of the first sub-contact.

In an embodiment, the semiconductor device may further include deviceisolation layers disposed in the substrate to define the first andsecond active patterns, and an interlayer insulating layer covering thefirst and second source/drain regions and sidewalls of the first gateelectrode. The bottom surface of the vertical extension may be disposedat a level between a top surface of the interlayer insulating layer andtop surfaces of the device isolation layers.

In an embodiment, a top surface of the second sub-contact may besubstantially coplanar with a top surface of the first sub-contact.

In an embodiment, the first sub-contact and the second sub-contact mayinclude the same material and may be connected to each other toconstitute one body.

In an embodiment, the vertical extension may overlap with the firstsub-contact in plan view.

In an embodiment, the top surface of the interlayer insulating layer maybe substantially coplanar with a top surface of the first gateelectrode.

In an embodiment, the semiconductor device may further include first andsecond conductive connection patterns provided on the first and secondsource/drain regions so as to be connected to the first and secondsource/drain regions, respectively. The first sub-contact may bedisposed on a top surface of the first conductive connection pattern soas to be electrically connected to the first source/drain region throughthe first conductive connection pattern, and the second sub-contact maybe provided between the first and second conductive connection patterns.

In an embodiment, the semiconductor device may further include a barrierlayer surrounding sidewalls and a bottom surface of the active contact.A portion of the barrier layer may be disposed between the firstsub-contact and the first conductive connection pattern.

In an embodiment, the semiconductor device may further include a secondgate electrode intersecting the first and second active patterns andextending in parallel to the first gate electrode. The first and secondgate electrodes may be spaced apart from each other in the firstdirection, and the active contact may be provided between the first andsecond gate electrodes in plan view.

In an embodiment, the semiconductor device may further include a cappinglayer covering top surfaces of the first and second gate electrodes incommon. The bottom surface of the vertical extension may be lower than abottom surface of the capping layer.

In an embodiment, the semiconductor device may further include a viaprovided on the active contact, and a conductive line provided on thevia so as to be electrically connected to the first source/drain regionthrough the via and the active contact.

In an embodiment, the active contact may have a T-shape when viewed froma cross-sectional view taken along the first direction.

In an embodiment, one sidewall of the second sub-contact, which isadjacent to the vertical extension, may have a stepped profile whenviewed from a cross-sectional view taken along the second direction.

In an embodiment, the first sub-contact may have a first sidewall, andthe second sub-contact may have a second sidewall adjacent to the firstsidewall. The first sidewall and the second sidewall may be coplanarwith each other.

In an embodiment, the first sub-contact may extend in the seconddirection to penetrate the second sub-contact in plan view.

In another aspect, a semiconductor device may include a substrate,device isolation layers provided in the substrate to define activepatterns, the active patterns including upper portions protruding fromtop surfaces of the device isolation layers, a source/drain regionprovide in the upper portion of at least one of the active patterns, aconductive connection pattern provided on the source/drain region so asto be connected to the source/drain region, an active contact providedon the conductive connection pattern so as to be electrically connectedto the source/drain region, the active contact including a firstsub-contact connected to a top surface of the conductive connectionpattern and a second sub-contact connected to the first sub-contact inone body, a via provided on the active contact, and a conductive lineprovided on the via so as to be electrically connected to thesource/drain region through the via and the active contact.

In an embodiment, the second sub-contact may include a verticalextension vertically extending toward the substrate, and the verticalextension may overlap with the first sub-contact in plan view.

In an embodiment, a bottom surface of the vertical extension may belower than a bottom surface of the first sub-contact.

In an embodiment, the semiconductor device may further include a barrierlayer surrounding the active contact. A portion of the barrier layer maybe disposed between the first sub-contact and the conductive connectionpattern.

In an embodiment, the semiconductor device may further include first andsecond gate electrodes spaced apart from each other with thesource/drain region interposed therebetween. The first and second gateelectrodes may extend in parallel to each other to intersect the activepatterns. The active contact may be disposed between the first andsecond gate electrodes in plan view, and the active contact may bespaced apart from all of the first and second gate electrodes.

In an embodiment, the semiconductor device may further include a cappinglayer covering top surfaces of the first and second gate electrodes incommon. The second sub-contact may penetrate the capping layer.

In still another aspect, a semiconductor device may include a substrate,device isolation layers disposed in the substrate to define activepatterns, the active patterns including upper portions protruding fromtop surfaces of the device isolation layers, a gate electrodeintersecting the active patterns, a source/drain region provided in theupper portion of at least one of the active patterns, the source/drainregion adjacent to the gate electrode, and an active contact disposed onthe source/drain region so as to be electrically connected to thesource/drain region. The active contact may be spaced apart from thegate electrode, and the active contact may include a vertical extensionhaving a bottom surface lower than a top surface of the gate electrode.

In an embodiment, the active contact may include a first sub-contactoverlapping with the source/drain region in plan view, and a secondsub-contact connected to the first sub-contact in one body. A portion ofthe second sub-contact, which vertically extends toward the substrate,may correspond to the vertical extension.

In an embodiment, the vertical extension may overlap with the firstsub-contact in plan view.

In yet another aspect, a method for manufacturing a semiconductor devicemay include forming first and second active patterns on a substrate,forming first and second gate electrodes extending in parallel to eachother to intersect the first and second active patterns, forming firstand second source/drain regions in upper portions of the first andsecond active patterns between the first and second gate electrodes,respectively, forming at least one interlayer insulating layer coveringthe first and second gate electrodes and the first and secondsource/drain regions, forming a first sub-contact hole overlapping withthe first source/drain region in a plan view by patterning the at leastone interlayer insulating layer, forming a second sub-contact holebetween the first and second source/drain regions in a plan view bypatterning the at least one interlayer insulating layer, the first andsecond sub-contact holes connected to each other to constitute onecommunicating hole, and forming an active contact filling thecommunicating hole. Forming the second sub-contact hole may includeforming a vertical extension hole vertically extending from a portion ofa bottom surface of the first sub-contact hole toward the substrate.

In an embodiment, a first layout defining a position of the firstsub-contact hole may be provided to partially overlap with a secondlayout defining a position of the second sub-contact hole, and thevertical extension hole may be formed in an overlapping region of thefirst and second layouts.

In an embodiment, the method may further include patterning the at leastone interlayer insulating layer to form a gate contact hole exposing atop surface of at least one of the first and second gate electrodes. Thegate contact hole may be formed simultaneously with the secondsub-contact hole.

In an embodiment, the method may further include forming first andsecond conductive connection patterns connected to the first and secondsource/drain regions, respectively. At least one of the interlayerinsulating layers may be formed to cover the first and second conductiveconnection patterns, and the first sub-contact hole may expose a topsurface of the first conductive connection pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

The inventive concepts will become more apparent in view of the attacheddrawings and accompanying detailed description.

FIG. 1 is an equivalent circuit diagram illustrating a static randomaccess memory (SRAM) cell according to example embodiments of theinventive concepts.

FIG. 2 is a plan view illustrating semiconductor devices according toexample embodiments of the inventive concepts.

FIGS. 3A, 3B, 3C, 3D, and 3E are cross-sectional views taken along linesA-A′, B-B′, C-C′, D-D′, and E-E′ of FIG. 2, respectively.

FIGS. 4, 6, and 8 are plan views illustrating methods for manufacturingsemiconductor devices according to example embodiments of the inventiveconcepts.

FIGS. 5A, 7A, and 9A are cross-sectional views taken along lines A-A′ ofFIGS. 4, 6, and 8, respectively.

FIGS. 5B, 7B, and 9B are cross-sectional views taken along lines B-B′ ofFIGS. 4, 6, and 8, respectively.

FIGS. 5C, 7C, and 9C are cross-sectional views taken along lines C-C′ ofFIGS. 4, 6, and 8, respectively.

FIGS. 7D and 9D are cross-sectional views taken along lines D-D′ ofFIGS. 6 and 8, respectively.

FIGS. 7E and 9E are cross-sectional views taken along lines E-E′ ofFIGS. 6 and 8, respectively.

FIG. 10 is a schematic block diagram illustrating an electronic systemincluding semiconductor devices according to example embodiments of theinventive concepts.

FIG. 11 is a schematic block diagram illustrating an electronic deviceincluding semiconductor devices according to example embodiments of theinventive concepts.

FIGS. 12 to 14 illustrate embodiments of multimedia devices includingsemiconductor devices according to example embodiments of the inventiveconcepts.

DETAILED DESCRIPTION OF EMBODIMENTS

The inventive concepts will now be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the inventive concepts are shown. The advantages and features of theinventive concepts and methods of achieving them will be apparent fromthe following exemplary embodiments that will be described in moredetail with reference to the accompanying drawings. It should be noted,however, that the inventive concepts are not limited to the followingexemplary embodiments, and may be implemented in various forms.Accordingly, the exemplary embodiments are provided only to disclose theinventive concepts and let those skilled in the art know the category ofthe inventive concepts. In the drawings, embodiments of the inventiveconcepts are not limited to the specific examples provided herein andare exaggerated for clarity.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to limit the invention. As usedherein, the singular terms “a,” “an” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it may be directlyconnected or coupled to the other element or intervening elements may bepresent. Similarly, it will be understood that when an element such as alayer, region or substrate is referred to as being “on” another element,it can be directly on the other element or intervening elements may bepresent. In contrast, the term “directly” means that there are nointervening elements. It will be further understood that the terms“comprises”, “comprising,”, “includes” and/or “including”, when usedherein, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

Additionally, embodiments in the detailed description will be describedwith sectional views as ideal exemplary views of the inventive concepts.Accordingly, shapes of the exemplary views may be modified according tomanufacturing techniques and/or allowable errors. Therefore, embodimentsof the inventive concepts are not limited to the specific shapeillustrated in the exemplary views, but may include other shapes thatmay be created according to manufacturing processes. Areas exemplifiedin the drawings have general properties, and are used to illustratespecific shapes of elements. Thus, this should not be construed aslimited to the scope of the inventive concepts.

It will be also understood that although the terms first, second, thirdetc. may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another element. Thus, a first element insome embodiments could be termed a second element in other embodimentswithout departing from the teachings of the present invention. Exemplaryembodiments of aspects of the present inventive concepts explained andillustrated herein include their complementary counterparts. The samereference numerals or the same reference designators denote the sameelements throughout the specification.

Moreover, exemplary embodiments are described herein with reference tocross-sectional illustrations and/or plane illustrations that areidealized exemplary illustrations. Accordingly, variations from theshapes of the illustrations as a result, for example, of manufacturingtechniques and/or tolerances, are to be expected. Thus, exemplaryembodiments should not be construed as limited to the shapes of regionsillustrated herein but are to include deviations in shapes that result,for example, from manufacturing. For example, an etching regionillustrated as a rectangle will, typically, have rounded or curvedfeatures. Thus, the regions illustrated in the figures are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to limit the scope ofexample embodiments.

As appreciated by the present inventive entity, devices and methods offorming devices according to various embodiments described herein may beembodied in microelectronic devices such as integrated circuits, whereina plurality of devices according to various embodiments described hereinare integrated in the same microelectronic device. Accordingly, thecross-sectional view(s) illustrated herein may be replicated in twodifferent directions, which need not be orthogonal, in themicroelectronic device. Thus, a plan view of the microelectronic devicethat embodies devices according to various embodiments described hereinmay include a plurality of the devices in an array and/or in atwo-dimensional pattern that is based on the functionality of themicroelectronic device.

The devices according to various embodiments described herein may beinterspersed among other devices depending on the functionality of themicroelectronic device. Moreover, microelectronic devices according tovarious embodiments described herein may be replicated in a thirddirection that may be orthogonal to the two different directions, toprovide three-dimensional integrated circuits.

Accordingly, the cross-sectional view(s) illustrated herein providesupport for a plurality of devices according to various embodimentsdescribed herein that extend along two different directions in a planview and/or in three different directions in a perspective view. Forexample, when a single active region is illustrated in a cross-sectionalview of a device/structure, the device/structure may include a pluralityof active regions and transistor structures (or memory cell structures,gate structures, etc., as appropriate to the case) thereon, as would beillustrated by a plan view of the device/structure.

FIG. 1 is an equivalent circuit diagram illustrating a static randomaccess memory (SRAM) cell according to example embodiments of theinventive concepts.

Referring to FIG. 1, a SRAM cell according to embodiments of theinventive concepts may include a first pull-up transistor TU1, a firstpull-down transistor TD1, a second pull-up transistor TU2, a secondpull-down transistor TD2, a first access transistor TA1, and a secondaccess transistor TA2. The first and second pull-up transistors TU1 andTU2 may be P-type metal-oxide-semiconductor (PMOS) transistors, but thefirst and second pull-down transistors TD1 and TD2 and the first andsecond access transistors TA1 and TA2 may be N-type MOS (NMOS)transistors.

A first source/drain of the first pull-up transistor TU1 and a firstsource/drain of the first pull-down transistor TD1 may be connected to afirst node N1. A second source/drain of the first pull-up transistor TU1may be connected to a power line Vcc, and a second source/drain of thefirst pull-down transistor TD1 may be connected to a ground line Vss. Agate of the first pull-up transistor TU1 may be electrically connectedto a gate of the first pull-down transistor TD1. Thus, the first pull-uptransistor TU1 and the first pull-down transistor TD1 may define a firstinverter. The gates of the first pull-up and first pull-down transistorsTU1 and TD1, which are connected to each other, may correspond to aninput terminal of the first inverter. The first node N1 may correspondto an output terminal of the first inverter.

A first source/drain of the second pull-up transistor TU2 and a firstsource/drain of the second pull-down transistor TD2 may be connected toa second node N2. A second source/drain of the second pull-up transistorTU2 may be connected to the power line Vcc, and a second source/drain ofthe second pull-down transistor TD2 may be connected to the ground lineVss. A gate of the second pull-up transistor TU2 may be electricallyconnected to a gate of the second pull-down transistor TD2. Thus, thesecond pull-up transistor TU2 and the second pull-down transistor TD2may define a second inverter. The gates of the second pull-up and secondpull-down transistors TU2 and TD2, which are connected to each other,may correspond to an input terminal of the second inverter. The secondnode N2 may correspond to an output terminal of the second inverter.

The first and second inverters may be combined with each other to definea latch structure. In other words, the gates of the first pull-up andfirst pull-down transistors TU1 and TD1 may be electrically connected tothe second node N2, and the gates of the second pull-up and secondpull-down transistors TU2 and TD2 may be electrically connected to thefirst node N1. A first source/drain of the first access transistor TA1may be connected to the first node N1, and a second source/drain of thefirst access transistor TA1 may be connected to a first bit line BL1. Afirst source/drain of the second access transistor TA2 may be connectedto the second node N2, and a second source/drain of the second accesstransistor TA2 may be connected to a second bit line BL2. Gates of thefirst and second access transistors TA1 and TA2 may be electricallyconnected to a word line WL. As a result, the SRAM cell according toembodiments of the inventive concepts may be realized.

[Semiconductor Device]

FIG. 2 is a plan view illustrating semiconductor devices according toexample embodiments of the inventive concepts. FIGS. 3A, 3B, 3C, 3D, and3E are cross-sectional views taken along lines A-A′, B-B′, C-C′, D-D′,and E-E′ of FIG. 2, respectively.

Referring to FIGS. 2 and 3A to 3E, a first device isolation layer ST1may be provided in a substrate 100 to define logic cells. FIG. 2illustrates one of the logic cells. The logic cell may correspond to aunit for performing a logic function. For example, the logic cell mayinclude the SRAM cell described with reference to FIG. 1. For example,the substrate 100 may be a silicon substrate, a germanium substrate, ora silicon-on-insulator (SOI) substrate.

Second device isolation layers ST2 may be provided in a substrate 100 todefine active patterns FN1 to FN6. The active patterns FN1 to FN6 mayinclude first to sixth active patterns FN1 to FN6 extending in a seconddirection D2 parallel to a top surface of the substrate 100. The activepatterns FN1 to FN6 may be arranged in a first direction D1 intersectingthe second direction D2. The first direction D1 may be parallel to thetop surface of the substrate 100. The second device isolation layers ST2extending in the second direction D2 may be disposed at both sides ofeach of the active patterns FN1 to FN6. In some embodiments, upperportions of the active patterns FN1 to FN6 may include fin portions,respectively. The fin portions may have fin shapes protruding frombetween the second device isolation layers ST2.

In some embodiments, each of the active patterns FN1 to FN6 may define aP-type metal-oxide-semiconductor field effect transistor (PMOSFET)region or an N-type MOSFET (NMOSFET) region. For example, the second,third and sixth active patterns FN2, FN3 and FN6 may define the PMOSFETregions, and the first, fourth and fifth active patterns FN1, FN4 andFN5 may define the NMOSFET regions. Distances between the activepatterns FN1 to FN6 may be varied according to region-types of theactive patterns FN1 to FN6. For example, the first active pattern FN1may be the NMOSFET region, and the second active pattern FN2 may be thePMOSFET region different from the NMOSFET region. In this case, thedistance between the first and second active patterns FN1 and FN2 may bedefined as a first distance. The second and third active patterns FN2and FN3 may be the PMOSFET regions. In other words, the second and thirdactive pattern FN2 and FN3 may be the same kind of regions. In thiscase, the distance between the second and third active patterns FN2 andFN3 may be defined as a second distance. Here, the second distance maybe greater than the first distance.

The first device isolation layer ST1 and the second device isolationlayers ST2 may be connected to each other to define an insulating layerthat is of one body or defines a unitary member. A thickness (or adepth) of the first device isolation layer ST1 may be greater thanthicknesses (or depths) of the second device isolation layers ST2. Inthis case, the second device isolation layers ST2 may be formed by aprocess different from a process of forming the first device isolationlayer ST1. In other embodiments, the second device isolation layers ST2may be formed simultaneously with the first device isolation layer ST1,so the thicknesses of the second device isolation layers ST2 may besubstantially equal to the thickness of the first device isolation layerST1. The first and second device isolation layers ST1 and ST2 may beformed in an upper portion of the substrate 100. For example, the firstand second device isolation layers ST1 and ST2 may include a siliconoxide layer.

Gate electrodes G1 to G6 may be provided on the active patterns FN1 toFN6. The gate electrodes G1 to G6 may extend in the first direction D1to intersect the active patterns FN1 to FN6. The gate electrodes G1 toG6 may be spaced apart from each other in the second direction D2. Thegate electrodes G1 to G6 may include first to sixth gate electrodes G1to G6 that extend in the first direction D1 to intersect the activepatterns FN1 to FN6 and the second device isolation layer ST2.

A gate insulating pattern G1 may be provided under each of the gateelectrodes G1 to G6, and gate spacers GS may be provided on bothsidewalls of each of the gate electrodes G1 to G6. A first interlayerinsulating layer 110 may be provided to fill spaces between the gateelectrodes G1 to G6. A capping layer GP may be provided on the firstinterlayer insulating layer 110 to extend on or cover top surfaces ofthe gate electrodes G1 to G6 in common. Second, third, fourth and fifthinterlayer insulating layers 115, 120, 130, and 140 may be sequentiallystacked on the capping layer GP. A first etch stop layer ES1 may bedisposed between the second and third interlayer insulating layers 115and 120, and a second etch stop layer ES2 may be disposed between thethird and fourth interlayer insulating layers 120 and 130. A third etchstop layer ES3 may be disposed between the fourth and fifth interlayerinsulating layers 130 and 140.

The gate electrodes G1 to G6 may include at least one of a dopedsemiconductor material, a metal, or a conductive metal nitride. The gateinsulating pattern G1 may include at least one of a silicon oxide layer,a silicon oxynitride layer, or a high-k dielectric layer having adielectric constant higher than that of the silicon oxide layer. Each ofthe capping layer GP and the gate spacer GS may include at least one ofa silicon oxide layer, a silicon nitride layer, or a silicon oxynitridelayer. Each of the first to fifth interlayer insulating layers 110, 115,120, 130 and 140 may include a silicon oxide layer and/or a siliconoxynitride layer. Each of the first to third etch stop layers ES1, ES2and ES3 may include silicon carbonitride (SiCN).

Source/drain regions SD1 to SD6 may be provided in upper portions of theactive patterns FN1 to FN6 disposed at both sides of each of the gateelectrodes G1 to G6. The source/drain regions SD1 to SD6 may includefirst to sixth source/drain regions SD1 to SD6 that are disposed in theupper portions of the first to sixth active patterns FN1 to FN6,respectively. As illustrated in FIGS. 3B, 3D, and 3E, the source/drainregions SD1 to SD6 may be disposed on the active patterns FN1 to FN6 andmay extend onto the substrate 100 (i.e., onto the second deviceisolation layers ST2). Alternatively, the source/drains SD may beconfined in the active patterns FN1 to FN6.

In some embodiments, the second, third and sixth source/drain regionsSD2, SD3 and SD6 of the second, third and sixth active patterns FN2, FN3and FN6 may be doped with P-type dopants, and the first, fourth andfifth source/drain regions SD1, SD4 and SD5 of the first, fourth andfifth active patterns FN1, FN4 and FN5 may be doped with N-type dopants.The fin portions which are disposed under and overlap with the gateelectrodes G1 to G6 may be used as channel regions.

The source/drain regions SD1 to SD6 may include epitaxial patternsformed by a selective epitaxial growth (SEG) process. In other words,the upper portions of the active patterns FN1 to FN6, in which thesource/drain regions SD1 to SD6 are formed, may include the epitaxialpatterns. Thus, top surfaces of the source/drain regions SD1 to SD6 maybe disposed at a higher level than top surfaces of the fin portions. Thesource/drain regions SD1 to SD6 may include a different semiconductorelement from the substrate 100. For example, the source/drain regionsSD1 to SD6 may include a semiconductor element of which a latticeconstant is larger or smaller than that of the semiconductor element ofthe substrate 100. Since the source/drain regions SD1 to SD6 include thedifferent semiconductor element from the substrate 100, the source/drainregions SD1 to SD6 may provide compressive stress or tensile stress tothe channel regions. For example, if the substrate 100 is a siliconsubstrate, the second, third and sixth source/drain regions SD2, SD3 andSD6 of the PMOSFET regions may include embedded silicon-germanium (SiGe)or germanium (Ge). In this case, the second, third and sixthsource/drain regions SD2, SD3 and SD6 may provide the compressive stressto the channel region adjacent thereto. On the other hand, if thesubstrate 100 is the silicon substrate, the first, fourth and fifthsource/drain regions SD1, SD4 and SD5 of the NMOSFET regions may includesilicon carbide (SiC). In this case, the first, fourth and fifthsource/drain regions SD1, SD4 and SD5 may provide the tensile stress tothe channel regions adjacent thereto. Since the source/drain regions SD1to SD6 provide the compressive stress or the tensile stress to thechannel regions, mobility of the carriers generated in the channelregions may be improved when the field effect transistors according tothe inventive concepts are operated.

Conductive connection patterns TS may be provided at both sides of eachof the gate electrodes G1 to G6. In some embodiments, some of theconductive connection patterns TS may be disposed to correspond to someof the source/drain regions SD1 to SD6, respectively. In other words,the some of the conductive connection patterns TS may be spaced apartfrom each other in the first direction D1, like the source/drain regionsSD1 to SD6. On the other hand, others of the conductive connectionpatterns TS may electrically connect others, spaced apart from eachother, of the source/drain regions SD1 to SD6 to each other. Forexample, the conductive connection pattern TS covering the fourth andfifth source/drain regions SD4 and SD5 in common may electricallyconnect the fourth and fifth source/drain regions SD4 and SD5 to eachother (see FIG. 3B).

The conductive connection patterns TS may be in direct contact with thesource/drain regions SD1 to SD6. The conductive connection patterns TSmay include a metal silicide. For example, the conductive connectionpatterns TS may include at least one of titanium silicide, tantalumsilicide, or tungsten silicide. The conductive connection patterns TSmay further include a metal layer. For example, the metal layer mayinclude at least one of titanium, tantalum, or tungsten. In anembodiment, each of the conductive connection patterns TS may includethe metal silicide layer and the metal layer disposed on the metalsilicide layer. The conductive connection patterns TS may be provided inthe first and second interlayer insulating layers 110 and 115 and thecapping layer GP.

First barrier layers BM1 may be provided between the conductiveconnection patterns TS and the first and second interlayer insulatinglayers 110 and 115, between the conductive connection patterns TS andthe capping layer GP, and between the conductive connection patterns TSand the source/drain regions SD1 to SD6. Each of the first barrierlayers BM1 may have a substantially uniform thickness and may extend onor surround each of the conductive connection patterns TS. However, topsurfaces of the conductive connection patterns TS may not be coveredwith the first barrier layer BM1. The first barrier layer BM1 mayinclude titanium/titanium nitride (Ti/TiN).

Source/drain contacts SDC and first to fourth active contacts CA1 to CA4may be provided on the conductive connection patterns TS. In someembodiments, the source/drain contacts SDC may be provided at both sidesof each of the gate electrodes G1 to G6 in plan view. Each of thesource/drain contacts SDC may extend on or cover the top surface of theconductive connection pattern TS and may have a bar shape extending inthe first direction D1. At least one of the source/drain contacts SDCmay electrically connect two or more conductive connection patterns TSto each other.

Gate contacts CB may be provided on the gate electrodes G1 to G6,respectively. In some embodiments, each of the gate contacts CB may bedisposed on an end portion of each of the gate electrodes G1 to G6. Thegate contacts CB may penetrate the second and third interlayerinsulating layers 115 and 120, the first etch stop layer ES1, and thecapping layer GP so as to be in direct contact with top surfaces of thegate electrodes G1 to G6. The gate electrodes G1 to G6 may beelectrically connected to conductive lines disposed thereon through thegate contacts CB and vias disposed on the gate contacts CB. For example,the fourth gate electrode G4 may be electrically connected to a fifthconductive line CBL5 through the gate contact CB and a fifth via V5disposed on the gate contact CB.

The source/drain contacts SDC and the gate contacts CB may include atleast one of a doped semiconductor material, a metal, or a conductivemetal nitride. Here, the conductive connection patterns TS may include adifferent material from the source/drain contacts SDC. For example, thesource/drain contacts SDC may include tungsten, and the conductiveconnection patterns TS may include a metal silicide.

In some embodiments, first, second and third active contacts CA1, CA2and CA3 may be provided on the second active pattern FN2, and a fourthactive contact CA4 may be provided on the third and fourth activepatterns FN3 and FN4. The fourth active contact CA4 may intersect thethird and fourth active patterns FN3 and FN4. In plan view, the firstactive contact CA1 may be provided between the first and second gateelectrodes G1 and G2, the second and fourth active contacts CA2 and CA4may be provided between the third and fourth gate electrodes G3 and G4,and the third active contact CA3 may be provided between the fifth andsixth gate electrodes G5 and G6.

Second barrier layers BM2 may be provided to extend on or surroundsidewalls and bottom surfaces of the first to fourth active contacts CA1to CA4. However, top surfaces of the first to fourth active contacts CA1to CA4 may not be covered with the second barrier layers BM2. Portionsof the second barrier layers BM2 may be disposed between the conductiveconnection patterns TS and the active contacts CA1 to CA4. The secondbarrier layers BM2 may include Ti/TiN. Thus, the second barrier layersBM2 may reduce or substantially prevent a metal from being diffusedbetween the conductive connection patterns TS and the active contactsCA1 to CA4.

Hereinafter, the first active contact CA1 will be first described inmore detail. The first active contact CA1 may include first and secondsub-contacts or portions SC1 and SC2. The first sub-contact SC1 may bedisposed on and connected to the top surface of the conductiveconnection pattern TS disposed on the second source/drain region SD2. Onthe contrary, the second sub-contact SC2 may be spaced apart from boththe second source/drain region SD2 and the conductive connection patternTS disposed on the second source/drain region SD2. In other words, thefirst sub-contact SC1 may overlap with the second source/drain regionSD2 in plan view, but the second sub-contact SC2 may be disposed betweenthe second and third source/drain regions SD2 and SD3 in plan view.

The first sub-contact SC1 and the second sub-contact SC2 may include thesame material and may be connected to each other to define the firstactive contact CA1 that is of one body or defines a unitary member. Thefirst and second sub-contacts SC1 and SC2 may include at least one of adoped semiconductor material, a metal, or a conductive metal nitride.For example, the first and second sub-contacts SC1 and SC2 may includethe same material as the source/drain contacts SDC. In such embodiments,the source/drain contacts SDC may correspond to active contacts thatinclude the first sub-contact or portion SC1 but are free of the secondsub-contact or portion SC2.

The first sub-contact SC1 may be provided in the third interlayerinsulating layer 120. Thus, a top surface of the first sub-contact SC1may be substantially coplanar with a top surface of the third interlayerinsulating layer 120. In addition, the top surface of the firstsub-contact SC1 may be disposed at the substantially same level as topsurfaces of the source/drain contacts SDC, and a bottom surface of thefirst sub-contact SC1 may be disposed at the substantially same level asbottom surfaces of the source/drain contacts SDC. The first sub-contactSC1 may be disposed between the first and second gate electrodes G1 andG2 in plan view. The first sub-contact SC1 may have a bar shapeextending in the first direction D1.

In some embodiments, a bottom surface of the second sub-contact SC2 maybe disposed at the substantially same level as bottom surfaces of thegate contacts CB. In other words, the bottom surface of the secondsub-contact SC2 may be disposed at the substantially same level as thetop surfaces of the gate electrodes G1 to G6. In other embodiments, thebottom surface of the second sub-contact SC2 may be disposed at a lowerlevel than the bottom surfaces of the gate contacts CB. However, theinventive concepts are not limited thereto. A top surface of the secondsub-contact SC2 may be substantially coplanar with the top surface ofthe first sub-contact SC1. In other words, the top surface of the secondsub-contact SC2 may be substantially coplanar with the top surface ofthe third interlayer insulating layer 120.

The second sub-contact SC2 may include a vertical extension VP thatextends toward the substrate 100 between the second and thirdsource/drain regions SD2 and SD3. In some embodiments, a bottom surfaceof the vertical extension VP may be lower than the bottom surface of thefirst sub-contact SC1. In addition, the bottom surface of the verticalextension VP may be lower than the top surfaces of the first and secondgate electrodes G1 and G2 adjacent to the vertical extension VP. Inother words, the bottom surface of the vertical extension VP may bedisposed at a level between the top surface of the first interlayerinsulating layer 110 and a top surface of the second device isolationlayer ST2. The vertical extension VP may be formed using double-etchingwhen the first and second sub-contacts SC1 and SC2 are formed. This willbe described later in more detail. As a result, the vertical extensionVP may also overlap with the first sub-contact SC1 in plan view.

Referring again to FIG. 3A, the vertical extension VP may extend fromthe bottom surface of the second sub-contact SC2 toward the substrate100 when viewed from a cross-sectional view taken along the seconddirection D2. Thus, the first active contact CA1 may have a T-shapedcross section. In addition, the second to fourth active contacts CA2 toCA4 may also have the same T-shaped cross section.

In the first active contact CA1, the second sub-contact SC2 may extendon or surround one end portion of the first sub-contact SC1 in planview. Thus, one sidewall, adjacent to the vertical extension VP, of thesecond sub-contact SC2 may have a stepped profile, as illustrated inFIG. 3D. In some embodiments, the bottom surface of the verticalextension VP may be disposed at a first height H1 from the top surfaceof the second device isolation layer ST2, and the bottom surface of thesecond sub-contact SC2 may be disposed at a second height H2 from thetop surface of the second device isolation layer ST2. At this time, thesecond height H2 may be higher than the first height H1. Thus, the onesidewall of the second sub-contact SC2 may have the stepped profile. Onthe other hand, the bottom surface of each of the gate contacts CB maybe disposed at a third height H3 from the top surfaces of the first andsecond device isolation layers ST1 and ST2. Here, the third height H3may be the same as or higher than the second height H2, as describedabove.

A first conductive line CBL1 may be disposed on the first active contactCA1. A first via V1 may be disposed between the first active contact CA1and the first conductive line CBL1. In more detail, the first via V1 maybe provided on the first active contact CA1. The first conductive lineCBL1 may be electrically connected to the second source/drain region SD2through the first via V1 and the first active contact CA1 to exchangeinput/output signals with the second source/drain region SD2. The firstvia V1 may be provided in the fourth interlayer insulating layer 130,and the first conductive line CBL1 may be provided in the fifthinterlayer insulating layer 140.

The second sub-contact SC2 may be formed at the same level as the gatecontacts CB, and the first active contact CA1 may be laterally enlargedfrom the first sub-contact SC1 to over the second device isolation layerST2 due to the second sub-contact SC2. Thus, the first via V1 may bestably formed on the first active contact CA1 having an enlarged planararea. As a result, when the first via V1 is formed, misalignment betweenthe first via V1 and the first active contact CA1 may be reduced orsubstantially prevented and a process margin may be improved. This meansthat reliability of the semiconductor devices may be improved. In otherwords, the second sub-contact SC2 may act as a pad on which the firstvia V1 is disposed. In addition, a contact area between the first activecontact CA1 and the first via V1 may be increased by the enlarged planararea of the first active contact CA1, and thus, semiconductor deviceswith a low contact resistance may be realized.

The first active contact CA1 described above may be one exampleaccording to some embodiments of the inventive concepts. Hereinafter,the second active contact CA2 corresponding to another example of theinventive concepts will be described in more detail. Hereinafter, thedescriptions to the same features as in the first active contact CA1will be omitted or mentioned briefly. In other words, differencesbetween the second active contact CA2 and the first active contact CA1will be mainly described.

The second active contact CA2 may include first and second sub-contactsSC1 and SC2. Unlike the first active contact CA1, one sidewall of thefirst sub-contact SC1 of the second active contact CA2 may be alignedwith one sidewall of the second sub-contact SC2 of the second activecontact CA2 (see FIG. 3B). In other words, the first sub-contact SC1 ofthe second active contact CA2 may have a first sidewall SW1, and thesecond sub-contact SC2 of the second active contact CA2 may have asecond sidewall SW2 adjacent to the first sidewall SW1. Here, the firstsidewall SW1 and the second sidewall SW2 may be coplanar with eachother.

A second conductive line CBL2 may be disposed on the second activecontact CA2. A second via V2 may be disposed between the second activecontact CA2 and the second conductive line CBL2. In more detail, thesecond via V2 may be provided on the second active contact CA2. Thesecond sub-contact SC2 of the second active contact CA2 may act as a padon which the second via V2 is disposed.

The third active contact CA3 may include first and second sub-contactsSC1 and SC2. Unlike the first active contact CA1, the first sub-contactSC1 of the third active contact CA3 may extend in the first direction D1to penetrate the second sub-contact SC2 in plan view. In other words, asillustrated in FIG. 3E, the first sub-contact SC1 of the third activecontact CA3 may laterally protrude from one sidewall of the secondsub-contact SC2 of the third active contact CA3 when viewed from across-sectional view taken along the first direction D1. This is becausethe first sub-contact SC1 of the third active contact CA3 may be offsetfrom the second sub-contact SC2 of the third active contact CA3 in adirection opposite to the first direction D1.

A third conductive line CBL3 may be disposed on the third active contactCA3. A third via V3 may be disposed between the third active contact CA3and the third conductive line CBL3. In more detail, the third via V3 maybe provided on the third active contact CA3. The second sub-contact SC2of the third active contact CA3 may act as a pad on which the third viaV3 is disposed.

Referring again to FIGS. 2 and 3B, the fourth active contact CA4 mayinclude first and second sub-contacts SC1 and SC2. Unlike the firstactive contact CA1, the second sub-contact SC2 of the fourth activecontact CA4 may be disposed on the conductive connection pattern TSconnecting the fourth and fifth source/drain regions SD4 and SD5 to eachother. Thus, the second sub-contact SC2 of the fourth active contact CA4may not include a vertical extension due to the conductive connectionpattern TS. Meanwhile, the first sub-contact SC1 of the fourth activecontact CA4 may be connected to two conductive connection patterns TSadjacent to each other. Thus, the third, fourth and fifth source/drainregions SD3, SD4 and SD5 may be electrically connected to each otherthrough the fourth active contact CA4 and the conductive connectionpatterns TS.

A fourth conductive line CBL4 may be disposed on the fourth activecontact CA4. A fourth via V4 may be disposed between the fourth activecontact CA4 and the fourth conductive line CBL4. In more detail, thefourth via V4 may be provided on the fourth active contact CA4. Thesecond sub-contact SC2 of the fourth active contact CA4 may act as a padon which the fourth via V4 is disposed.

[Manufacturing Method]

FIGS. 4, 6, and 8 are plan views illustrating methods for manufacturingsemiconductor devices according to example embodiments of the inventiveconcepts. FIGS. 5A, 7A, and 9A are cross-sectional views taken alonglines A-A′ of FIGS. 4, 6, and 8, respectively. FIGS. 5B, 7B, and 9B arecross-sectional views taken along lines B-B′ of FIGS. 4, 6, and 8,respectively. FIGS. 5C, 7C, and 9C are cross-sectional views taken alonglines C-C′ of FIGS. 4, 6, and 8, respectively. FIGS. 7D and 9D arecross-sectional views taken along lines D-D′ of FIGS. 6 and 8,respectively. FIGS. 7E and 9E are cross-sectional views taken alonglines E-E′ of FIGS. 6 and 8, respectively.

Referring to FIGS. 4, 5A, 5B and 5C, a first device isolation layer ST1may be formed in a substrate 100 to define logic cells. In addition,second device isolation layers ST2 may be formed in the substrate 100 ofeach of the logic cells to define a plurality of active patterns FN1 toFN6. The second device isolation layers ST2 may extend in the seconddirection D2, so the active patterns FN1 to FN6 may extend in the seconddirection D2 and may be spaced apart from each other in the firstdirection D1. The substrate 100 may be, for example, a siliconsubstrate, a germanium substrate, or a SOI substrate. The first andsecond device isolation layers ST1 and ST2 may be formed by ashallow-trench isolation (STI) process and may include, for example, asilicon oxide layer.

Each of the first and second device isolation layers ST1 and ST2 mayhave a depth in a direction opposite to the third direction D3. Thethird direction D3 may be perpendicular to the first and seconddirections D1 and D2 and may be perpendicular to the top surface of thesubstrate 100. In some embodiments, the depths of the second deviceisolation layers ST2 may be smaller than that of the first deviceisolation layer ST1. In this case, the second device isolation layersST2 may be formed by a process different from a process of forming thefirst device isolation layer ST1. In other embodiments, the first andsecond device isolation layers ST1 and ST2 may be formed at the sametime, and the second device isolation layers ST2 may have thesubstantially same depth as the first device isolation layer ST1.

The active patterns FN1 to FN6 may include first to sixth activepatterns FN1 to FN6. The active patterns FN1 to FN6 may include finportions protruding from between the second device isolation layers ST2.The fin portions may correspond to upper portions of the active patternsFN1 to FN6.

Gate electrodes G1 to G6 may be disposed on the substrate 100 and mayextend in the first direction D1 to intersect the active patterns FN1 toFN6. The gate electrodes G1 to G6 may include first to sixth gateelectrodes G1 to G6 which extend in parallel to each other and intersectthe active patterns FN1 to FN6. The gate electrodes G1 to G6 may bespaced apart from each other in the second direction D2.

A gate insulating pattern G1 may be formed between each of the gateelectrodes G1 to G6 and the substrate 100. Gate spacers GS may be formedon both sidewalls of each of the gate electrodes G1 to G6. The gateinsulating pattern G1 may extend to be disposed between each of the gateelectrodes G1 to G6 and the gate spacers GS. Forming the gate electrodesG1 to G6, the gate insulating patterns GI, and the gate spacers GS mayinclude forming sacrificial gate patterns on the substrate 100, formingthe gate spacers GS on both sidewalls of each of the sacrificial gatepatterns, and replacing the sacrificial gate patterns with the gateinsulating patterns GI and the gate electrodes G1 to G6. The gateinsulating patterns GI may include at least one of a silicon oxidelayer, a silicon oxynitride layer, or a high-k dielectric layer having adielectric constant higher than that of the silicon oxide layer. Thegate electrodes G1 to G6 may include at least one of a dopedsemiconductor material, a metal, or a conductive metal nitride. The gatespacers GS may include at least one of a silicon oxide layer, a siliconnitride layer, a silicon oxynitride layer.

In some embodiments, ion implantation processes may be performed on thesubstrate 100 having the gate electrodes G1 to G6 to form source/drainregions SD1 to SD6 in active patterns FN1 to FN6 at both sides of eachof the gate electrodes G1 to G6. First to sixth source/drain regions SD1to SD6 may be respectively formed in the first to sixth active patternsFN1 to FN6 at both sides of each of the gate electrodes G1 to G6. Thesource/drain regions SD1 to SD6 may not be formed in the fin portions ofthe active patterns FN1 to FN6, which are disposed under and overlapwith the gate electrodes G1 to G6.

The second, third and sixth active patterns FN2, FN3 and FN6 may definePMOSFET regions, so the second, third and sixth source/drain regionsSD2, SD3 and SD6 may be doped with P-type dopants. The first, fourth andfifth active patterns FN1, FN4 and FN5 may define NMOSFET regions, sothe first, fourth and fifth source/drain regions SD1, SD4 and SD5 may bedoped with N-type dopants.

In other embodiments, as illustrated in FIG. 5B, forming thesource/drain regions SD1 to SD6 may include forming epitaxial patternson the active patterns FN1 to FN6. Forming the epitaxial patterns mayinclude removing upper portions of the active patterns FN1 to FN6 atboth sides of each of the gate electrodes G1 to G6, and performing aselective epitaxial growth (SEG) process using exposed lower portions ofthe active patterns FN1 to FN6 as seeds or seed layers. The epitaxialpatterns may be doped in-situ or may be doped using ion implantationprocesses. The epitaxial patterns may correspond to upper portions ofthe active patterns FN1 to FN6. In other words, the upper portions ofthe active patterns FN1 to FN6 at both sides of each of the gateelectrodes G1 to G6 may be replaced with or may otherwise include theepitaxial patterns.

A first interlayer insulating layer 110 may be formed on the substrate100 to extend on or cover the source/drain regions SD1 to SD6 and tofill spaces between the gate electrodes G1 to G6. In some embodiments,the epitaxial patterns and the first interlayer insulating layer 110 maybe formed before replacing the sacrificial gate patterns with the gateinsulating patterns GI and the gate electrodes G1 to G6. The firstinterlayer insulating layer 110 may be planarized to expose top surfacesof the sacrificial gate patterns, and then, the sacrificial gatepatterns may be replaced with the gate insulating patterns GI and thegate electrodes G1 to G6. A capping layer GP may be formed on the firstinterlayer insulating layer 110 to extend on or cover top surfaces ofthe gate electrodes G1 to G6. The capping layer GP may include at leastone of a silicon oxide layer, a silicon nitride layer, a siliconoxynitride layer. A second interlayer insulating layer 115 may be formedon the capping layer GP. Each of the first and second interlayerinsulating layers 110 and 115 may include at least one of a siliconoxide layer or a silicon oxynitride layer.

Conductive connection patterns TS may be formed to penetrate the firstand second interlayer insulating layers 110 and 115 and the cappinglayer GP. The conductive connection patterns TS may be connected to thesource/drain regions SD1 to SD6. Forming the conductive connectionpatterns TS may include forming recess regions penetrating the first andsecond interlayer insulating layers 110 and 115 and the capping layer GPto expose the source/drain regions SD1 to SD6, filling the recessregions with a conductive material, and planarizing the conductivematerial until the second interlayer insulating layer 115 is exposed. Inaddition, a first barrier layer BM1 may be deposited on inner surfacesof the recess regions before the recess regions are filled with theconductive material. The first barrier layer BM1 may include Ti/TiN.

The conductive connection patterns TS may include a metal silicide. Forexample, the conductive connection patterns TS may include at least oneof titanium silicide, tantalum silicide, or tungsten silicide. Theconductive connection patterns TS may further include a metal layer. Forexample, the metal layer may include at least one of a titanium layer, atantalum layer, or a tungsten layer. In an embodiment, the conductiveconnection patterns TS may include the metal silicide layer and themetal layer disposed on the metal silicide layer.

In some embodiments, some of the conductive connection patterns TS maybe disposed to correspond to some of the source/drain regions SD1 toSD6, respectively. Others of the conductive connection patterns TS mayelectrically connect the source/drain regions, spaced apart from eachother in the first direction D1, to each other. Top surfaces of theconductive connection patterns TS may be disposed at a higher level thanthe top surfaces of the gate electrodes G1 to G6.

Referring to FIGS. 6, 7A, 7B, 7C, 7D, and 7E, a first etch stop layerES1 and a third interlayer insulating layer 120 may be sequentiallyformed on the resultant structure including the conductive connectionpatterns TS. The first etch stop layer ES1 may include SiCN, and thethird interlayer insulating layer 120 may include at least one of asilicon oxide layer or a silicon oxynitride layer. The first etch stoplayer ES1 may reduce or substantially prevent a metal included in theconductive connection patterns TS from being diffused through theexposed top surfaces of the conductive connection patterns TS.

The third interlayer insulating layer 120 and the first etch stop layerES1 may be patterned using a first photo mask to form first sub-contactholes SH1 and source/drain contact holes SDH. In other words, the firstsub-contact holes SH1 and the source/drain contact holes SDH may beformed using a first photolithography process at the same time. Theprocess of patterning the third interlayer insulating layer 120 and thefirst etch stop layer ES1 may be performed until a top surface of thesecond interlayer insulating layer 115 and top surfaces of theconductive connection patterns TS are exposed.

In some embodiments, the first sub-contact holes SH1 may be formedbetween the first and second gate electrodes G1 and G2, between thethird and fourth gate electrodes G3 and G4, and between the fifth andsixth gate electrodes G5 and G6, respectively, in plan view. Some of thefirst sub-contact holes SH1 may be formed on the second source/drainregions SD2, respectively, and another of the first sub-contact holesSH1 may be formed on the third and fourth source/drain regions SD3 andSD4. The first sub-contact holes SH1 may have bar shapes extending inthe first direction D1 in plan view.

The source/drain contact holes SDH may have the substantially same depthas the first sub-contact holes SH1. In addition, source/drain contactholes SDH may have the substantially same width as the first sub-contactholes SH1. The source/drain contact holes SDH may expose the conductiveconnection patterns TS at both sides of the gate electrodes G1 to G6,like the first sub-contact holes SH1. The source/drain contact holes SDHmay have bar shapes that extend along the top surfaces of the conductiveconnection patterns TS in the first direction D1.

Referring to FIGS. 8, 9A, 9B, 9C, 9D, and 9E, a mask layer 150 may beformed on the third interlayer insulating layer 120 to fill the firstsub-contact holes SH1 and the source/drain contact holes SDH. The masklayer 150 may include, for example, a spin-on-hardmask (SOH) material.

The mask layer 150 may be patterned using a second photo mask to formsecond sub-contact holes SH2 and gate contact holes CBH. The secondphoto mask may be different from the first photo mask described above.In other words, the second sub-contact holes SH2 and the gate contactholes CBH may be formed using a second photolithography process at thesame time. The first to third interlayer insulating layers 110, 115 and120 and the first etch stop layer ES1 may also be patterned while themask layer 150 is patterned. The process of patterning the mask layer150 may be performed until the gate electrodes G1 to G6 are exposedthrough the gate contact holes CBH. In other words, portions of thecapping layer GP disposed on the gate electrodes G1 to G6 may becompletely removed when the gate contact holes CBH are formed.

Each of some of the second sub-contact holes SH2 may be formed betweenthe second and third source/drain regions SD2 and SD3 in plan view.Another of the second sub-contact holes SH2 may be formed between thefourth and fifth source/drain regions SD4 and SD5 in plan view. Thesecond sub-contact holes SH2 may be connected to the first sub-contactholes SH1, respectively. In other words, in plan view, a firstcommunicating hole CH1 may be formed between the first and second gateelectrodes G1 and G2, second and fourth communicating holes CH2 and CH4may be formed between the third and fourth gate electrodes G3 and G4,and a third communicating hole CH3 may be formed between the fifth andsixth gate electrodes G5 and G6.

In more detail, each of the first to fourth communicating holes CH1 toCH4 may include the first sub-contact hole SH1 and the secondsub-contact hole SH2. The second sub-contact hole SH2 may include avertical extension hole VH extending toward the top surface of thesubstrate 100. A bottom surface of the vertical extension hole VH may bedisposed at a level between a top surface of the first interlayerinsulating layer 110 and a top surface of the second device isolationlayer ST2.

Referring again to FIGS. 6 and 8, the first sub-contact holes SH1 may beformed using the first photolithography process which uses first layoutsdefining positions of the first sub-contact holes SH1. The secondsub-contact holes SH2 may be formed using the second photolithographyprocess which uses second layouts defining positions of the secondsub-contact holes SH2. Here, the second layouts may overlap withportions of the first layouts, respectively. Thus, portions of bottomsurfaces of the first sub-contact holes SH1 may be etched again duringthe patterning process using the second photolithography process(double-etching). As a result, an overlapping region of the second andfirst sub-contact holes SH2 and SH1 (e.g., an overlapping region of thefirst and second layouts) may be over-etched to form the verticalextension hole VH. The vertical extension hole VH may also overlap withthe first sub-contact hole SH1 in plan view.

Referring again to FIG. 9D, the bottom surface of the vertical extensionhole VH may be positioned at a first height H1 from the top surface ofthe second device isolation layer ST2, and a bottom surface of thesecond sub-contact hole SH2 may be positioned at a second height H2 fromthe top surface of the second device isolation layer ST2. Here, thesecond height H2 may be higher than the first height H1. Thus, onesidewall of the second sub-contact SH2 of the first communicating holeCH1 may have a stepped profile. Meanwhile, a bottom surface of each ofthe gate contact holes CBH may be positioned at a third height H3 fromthe top surfaces of the first and second device isolation layers ST1 andST2. Here, the third height H3 may be the substantially same as orhigher than the second height H2.

Referring again to FIGS. 2 and 3A to 3E, the mask layer 150 may beremoved. The mask layer 150 may be removed using an ashing processand/or a strip process. Thereafter, a second barrier layer BM2 and aconductive layer may be formed on the third interlayer insulating layer120 to fill the first to fourth communicating holes CH1 to CH4, the gatecontact holes CBH, and the source/drain contact holes SDH. The secondbarrier layer BM2 may include Ti/TiN, and the conductive layer mayinclude at least one of a doped semiconductor material, a metal, or aconductive metal nitride. The conductive layer and the second barrierlayer BM2 may be planarized until the third interlayer insulating layer120 is exposed, thereby forming first to fourth active contacts CA1 toCA4 in the first to fourth communicating holes CH1 to CH4, gate contactsCB in the gate contact holes CBH, and source/drain contacts SDC in thesource/drain contact holes SDH, respectively. In more detail, each ofthe first to fourth active contacts CA1 to CA4 may include first andsecond sub-contacts SC1 and SC2 constituting one body. Each of thesecond barrier layers BM2 may extend on or surround each of the first tofourth active contacts CA1 to CA4. In particular, portions of the secondbarrier layers BM2 may be disposed between the conductive connectionpatterns TS and the active contacts CA1 to CA4, respectively.

Next, a second etch stop layer ES2, a fourth interlayer insulating layer130, a third etch stop layer ES3, and a fifth interlayer insulatinglayer 140 may be sequentially formed on the third interlayer insulatinglayer 120 to extend on or cover the first to fourth active contacts CA1to CA4, the gate contacts CB, and the source/drain contacts SDC. Vias V1to V5 and conductive lines CBL1 to CBL5 may be formed. The vias V1 to V5may penetrate the fourth interlayer insulating layer 130, and theconductive lines CBL1 to CBL5 may be formed in the fifth interlayerinsulating layer 140.

The first to fourth vias V1 to V4 may be formed on the first to fourthactive contacts CA1 to CA4, respectively. Each of the first to fourthactive contacts CA1 to CA4 may include the second sub-contact SC2 whichis formed simultaneously with the gate contacts CB. The secondsub-contacts SC2 may further enlarge planar contact areas of the firstto fourth active contacts CA1 to CA4, and thus, misalignment of thefirst to fourth vias V1 to V4 may be reduced or minimized orsubstantially prevented. This means that a margin of the process forforming the first to fourth vias V1 to V4 may be improved. In addition,contact areas of the active contacts CA1 to CA4 and the vias V1 to V4may be increased by the wide planar areas of the active contacts CA1 toCA4. Thus, it is possible to realize semiconductor devices with a lowcontact resistance and excellent reliability through less complexprocesses.

[Applications]

FIG. 10 is a schematic block diagram illustrating an electronic systemincluding semiconductor devices according to example embodiments of theinventive concepts.

Referring to FIG. 10, an electronic system 1100 according to anembodiment of the inventive concept may include a controller 111Q, aninput/output (I/O) device 112Q, a memory device 1130, an interface unit1140, and a data bus 1150. At least two of the controller 1110, the I/Odevice 1120, the memory device 1130, and the interface unit 1140 maycommunicate with each other through the data bus 1150. The data bus 1150may correspond to a path through which electrical signals aretransmitted.

The controller 1110 may include at least one of a microprocessor, adigital signal processor, a microcontroller, or other logic deviceshaving a similar function to any one thereof. The I/O device 1120 mayinclude a keypad, a keyboard and/or a display device. The memory device1130 may store data and/or commands. The memory device 1130 may includea non-volatile memory device (e.g., a flash memory device, a phasechange memory device, and/or a magnetic memory device). In addition, thememory device 1130 may further include a volatile memory device. In thiscase, the memory device 1130 may include a SRAM device includingsemiconductor devices according to the aforementioned embodiments of theinventive concepts. The memory device 1130 may be omitted according toapplication of the electronic system 1100 or an electronic productimplemented with the electronic system 1100. The interface unit 1140 maytransmit electrical data to a communication network or may receiveelectrical data from a communication network. The interface unit 1140may operate wirelessly or by cable. For example, the interface unit 1140may include an antenna or a wireless/cable transceiver. Semiconductordevices according to the aforementioned embodiments of the inventiveconcepts may be applied to the controller 1110 or a portion of the I/Odevice 1120. The electronic system 1100 may further include a fastdynamic random access memory (DRAM) device and/or a fast SRAM devicewhich acts as a cache memory for improving an operation of thecontroller 1110.

FIG. 11 is a schematic block diagram illustrating an electronic deviceincluding semiconductor devices according to example embodiments of theinventive concepts.

Referring to FIG. 11, an electronic device 120Q may include asemiconductor chip 1210. The semiconductor chip 1210 may include aprocessor 1211, an embedded memory 1213, and a cache memory 1215.

The processor 1211 may include one or more processor cores C1 to Cn. Theone or more process cores C1 to Cn may process electrical data andelectrical signals. The processor cores C1 to Cn may include a pluralityof logic cells. In some embodiments, the logic cells may includesemiconductor devices according to the above mentioned embodiments ofthe inventive concepts.

The electronic device 1200 may perform a specific function using theprocessed data and signals. For example, the processor 1211 may be anapplication processor.

The embedded memory 1213 may exchange first data DAT1 with the processor1211. The first data DAT1 may be data processed or to be processed bythe one or more processor cores C1 to Cn. The embedded memory 1213 maymanage the first data DAT1. For example, the embedded memory 1213 maybuffer the first data DAT1. In other words, the embedded memory 1213 mayact as a buffer memory or working memory of the processor 1211.

In some embodiments, the electronic device 1200 may be applied to awearable electronic device. The wearable electronic device may mainlyperform functions requiring a relatively small quantity of operations.Thus, when the electronic device 1200 is applied to the wearableelectronic device, the embedded memory 1213 may not have a large buffercapacity.

The embedded memory 1213 may be a SRAM. An operating speed of the SRAMmay be faster than that of a DRAM. When the SRAM is embedded in thesemiconductor chip 1210, it is possible to realize the electronic device1200 having a small size and a fast operating speed. In addition, whenthe SRAM is embedded in the semiconductor chip 1210, consumption of anactive power of the electronic device 1200 may be reduced. In someembodiments, the SRAM may include semiconductor devices according to theabove mentioned embodiments of the inventive concepts.

The cache memory 1215 may be mounted on the semiconductor chip 1210along with the one or more process cores C1 to Cn. The cache memory 1215may store cache data DATc. The cache data DATc may be data used by theone or more process cores C1 to Cn. The cache memory 1215 may have arelatively small capacity but may have a very fast operating speed. Forexample, the cache memory 1215 may include a SRAM includingsemiconductor devices according to the above mentioned embodiments ofthe inventive concepts. When the cache memory 1215 is used, it ispossible to reduce an accessing number and an accessing time of theprocessor 1211 with respect to the embedded memory 1213. Thus, theoperating speed of the electronic device 1200 may be improved when thecache memory 1215 is used.

In FIG. 11, the cache memory 1215 is separated from the processor 1211for the purpose of ease and convenience in explanation. However, inother embodiments, the cache memory 1215 may be configured to beincluded in the processor 1211. In other words, embodiments of theinventive concepts are not limited to the embodiment illustrated in FIG.11.

The processor 1211, the embedded memory 1213, and the cache memory 1215may transmit electrical data on the basis of at least one of variousinterface protocols. For example, the processor 1211, the embeddedmemory 1213, and the cache memory 1215 may transmit electrical data onthe basis of at least one interface protocol of universal serial bus(USB), small computer system interface (SCSI), peripheral componentinterconnect (PCI) express, advanced technology attachment (ATA),parallel ATA (PATA), serial ATA (SATA), serial attached SCSI (SAS),integrated drive electronics (IDE), or universal flash storage (UFS).

FIGS. 12 to 14 illustrate embodiments of multimedia devices includingsemiconductor devices according to example embodiments of the inventiveconcepts. The electronic system 1100 of FIG. 10 and/or the electronicdevice 1200 of FIG. 11 may be applied to a mobile or smart phone 2000illustrated in FIG. 12, a tablet or smart table 3000 illustrated in FIG.13, and/or a notebook computer 4000 illustrated in FIG. 14.

In semiconductor devices according to example embodiments of theinventive concepts, the enlarged active contact disposed on thesource/drain region may be formed by less complex processes. Thus, themisalignment of the via on the active contact may be reduced orsubstantially prevented and the process margin may be improved. As such,the reliability of semiconductor devices may be improved. In addition,the contact area between the active contact and the via may be increasedto reduce the resistance of semiconductor devices.

While the inventive concepts have been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirits and scopes of the inventive concepts. Therefore, itshould be understood that the above embodiments are not limiting, butillustrative. Thus, the scopes of the inventive concepts are to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

1-7. (canceled)
 8. A semiconductor device comprising: a substrate; adevice isolation layer disposed on the substrate to define a firstactive pattern and a second active pattern, the first and second activepatterns extending in a first direction and including upper portionsprotruding upwardly with respect to a top surface of the deviceisolation layer; a gate electrode on the upper portions of the first andsecond active patterns, the gate electrode extending in a seconddirection intersecting the first direction; first and secondsource/drain regions disposed on the upper portions of the first andsecond active patterns, respectively, at one side of the gate electrode;and an active contact on the first source/drain region and electricallyconnected to the first source/drain region, wherein the first and secondsource/drain regions are electrically isolated from each other, whereinthe active contact includes a first portion vertically overlapping withthe first source/drain region, and a second portion extending from thefirst portion toward the device isolation layer, and wherein a bottomsurface of the second portion is lower than a bottom surface of thefirst portion.
 9. The semiconductor device of claim 8, wherein thebottom surface of the second portion is lower than a top surface of thegate electrode and higher than a bottom surface of the gate electrode onthe device isolation layer.
 10. The semiconductor device of claim 8,wherein the second portion is spaced apart from the device isolationlayer with an insulating material interposed therebetween.
 11. Thesemiconductor device of claim 8, wherein the first portion extends inthe second direction on the first source/drain region, such that thesecond portion vertically overlaps with the device isolation layerbetween the first and second source/drain regions.
 12. The semiconductordevice of claim 8, further comprising a barrier layer covering theactive contact, wherein the barrier layer covers outer surfaces of thefirst and second portions, except an interface between the first andsecond portions.
 13. The semiconductor device of claim 8, wherein thesecond portion has a width in the second direction, and wherein thewidth of the second portion increases in a vertical direction away fromthe device isolation layer.
 14. The semiconductor device of claim 8,further comprising a conductive connection pattern between the firstsource/drain region and the first portion, wherein the conductiveconnection pattern directly contacts the first source/drain region, andthe first portion directly contacts the conductive connection pattern.15. A semiconductor device comprising: a substrate; a device isolationlayer disposed on the substrate to define a first active pattern and asecond active pattern, the first and second active patterns extending ina first direction and including upper portions protruding upwardly withrespect to a top surface of the device isolation layer; a gate electrodeon the upper portions of the first and second active patterns, the gateelectrode extending in a second direction intersecting the firstdirection; first and second source/drain regions disposed on the upperportions of the first and second active patterns, respectively, at oneside of the gate electrode; and an active contact on the firstsource/drain region and electrically connected to the first source/drainregion, wherein the active contact includes a first portion verticallyoverlapping with the first source/drain region, and a second portionextending from the first portion toward the device isolation layer, andwherein the second portion is spaced apart from the device isolationlayer with an insulating material interposed therebetween.
 16. Thesemiconductor device of claim 15, wherein the second portion is spacedapart from the first and second source/drain regions with the insulatingmaterial interposed therebetween.
 17. The semiconductor device of claim15, wherein the first portion extends in the second direction on thefirst source/drain region, such that the second portion verticallyoverlaps with the device isolation layer between the first and secondsource/drain regions.
 18. The semiconductor device of claim 15, furthercomprising a barrier layer covering the active contact, wherein thebarrier layer covers outer surfaces of the first and second portions,except an interface between the first and second portions.
 19. Thesemiconductor device of claim 15, wherein the first portion and thesecond portion include a same material and are directly connected toeach other to define one body.
 20. The semiconductor device of claim 15,wherein the second portion has a width in the second direction, andwherein the width of the second portion increases in a verticaldirection away from the device isolation layer.
 21. The semiconductordevice of claim 15, further comprising a conductive connection patternbetween the first source/drain region and the first portion, wherein theconductive connection pattern directly contacts the first source/drainregion, and the first portion directly contacts the conductiveconnection pattern.
 22. The semiconductor device of claim 15, whereinthe gate electrode comprises a pair of gate electrodes, wherein thefirst and second source/drain regions are interposed between the pair ofgate electrodes, and wherein the second portion includes a verticalextension extending toward the device isolation layer between the pairof gate electrodes.
 23. A semiconductor device comprising: a substrate;a device isolation layer disposed on the substrate to define a firstactive pattern and a second active pattern, the first and second activepatterns including upper portions protruding upwardly with respect to atop surface of the device isolation layer; a gate electrode on the upperportions of the first and second active patterns; first and secondsource/drain regions disposed on the upper portions of the first andsecond active patterns, respectively, at one side of the gate electrode;an active contact on the first source/drain region and electricallyconnected to the first source/drain region; and an interlayer insulatinglayer covering at least a sidewall of the active contact, wherein theactive contact includes a first portion vertically overlapping with thefirst source/drain region, and a second portion extending from the firstportion toward the device isolation layer, and wherein a top surface ofthe interlayer insulating layer, a top surface of the first portion anda top surface of the second portion are coplanar with each other. 24.The semiconductor device of claim 23, wherein the second portion isspaced apart from the device isolation layer with an insulating materialinterposed therebetween.
 25. The semiconductor device of claim 23,wherein the first portion horizontally extends on the first source/drainregion, such that the second portion vertically overlaps with the deviceisolation layer between the first and second source/drain regions. 26.The semiconductor device of claim 23, further comprising a barrier layercovering the active contact, wherein the barrier layer covers outersurfaces of the first and second portions, except an interface betweenthe first and second portions.
 27. The semiconductor device of claim 23,further comprising a conductive line on the interlayer insulating layerand electrically connected to the active contact through a via, whereinthe via is in direct contact with the top surface of the second portion.